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Total results returned: 3

Thermal Management

A Top-Side Cooled Package to Best Dissipate Heat

In recent years, semiconductor manufacturers have developed power component packages which use a different thermal management approach - instead of placing the thermal pad on the bottom of a device pointing towards the PCB, the exposed metal pad is placed on the top side of the device.

Audience:
Automotive Component Manufacturers, Electric Vehicle Manufacturers, Thermal Management Researchers, Thermal Systems Engineers
Electric Vehicle Design

Design of a Smart Actuation for a Fully Electrified Suspension System

Audience:
Automotive Component Manufacturers, Automotive Engineers, Electric Vehicle Designers, Electric Vehicle Developers, EV Manufacturers, Power Electronics Researchers
Powertrain Modularity & Integration

E-VOLVE Cluster: Increasing Innovation Efficiency to Support the Transition Toward Sustainable e-mobility

Audience:
Electric Powertrain Researchers, Electric Vehicle Researchers, Environmental and Energy Efficiency Experts, Motor Design Researchers, Power Electronic Engineers, Power Electronics Researchers